Bespoke Automation Cable Preparation Service
X-Ray Inspection
Contax Product Image
  • 0.2 µm (microns) feature recognition
  • > 2130x geometric magnification
  • Nearly 13,300x total magnification
  • Oblique view at highest magnification up to 70°
  • Integrated noise suppression system

X RAY FOR PCB ASSEMBLIES
Phoenix nanome¦x

Contax Ltd - UK

The nanome|x is an ultra high-resolution X-ray system for the inspection of high-end interconnection technology in the semiconductor and SMT industry, with the option of combined 2D/3D operation. Features include long life-time transmission tube, high-power nanofocus® tube with different operation mode (4-in-1), 0.2 µm (microns) feature recognition, multiple axis manipulation including the oblique view at highest magnification (option) up to 70°, high resolution image chain with WINDOWS image processing. The nanome¦x is most suited for analysis of inner lead and outer lead bond integrity including detection of finest wire defects, flip-chip to substrate bond integrity die-attach voiding, voiding calculation on area array devices according to IPC standards, and pad wetting analysis on area array devices.