FLIP CHIP BONDER
SMB 1000

Contax Ltd - UK

SYSMELEC's Microsystems Assembler SMB 1000 is a standardised machine configured for fully automated flip chip bonding.

The patented Optobonder head offers the latest innovation in bonding techniques focussed on optoelectronic devices. The main characteristic of the Optobonder head is an optical unit, which allows measurment of the components simultaneously from the top and from the bottom.

Specific peripherals enable customising of the basic configuration to exactly meet your needs. Operations like welding in the ovens or on a thermode are readily integrated in the machine.