Bespoke Automation Cable Preparation Service
Sysmelec Assembly and Bonding
SMA 1000
  • High precision machine for assembly or bonding
  • Vision only from the top of the component
  • Assembly precision + / - 2 microns



MICROSYSTEMS AND CHIP ASSEMBLER
SMA 1000

Contax Ltd - UK

SYSMELEC's Microsystems Assembler SMA 1000 has specially been designed for industrial assembly of microsystems.

Its modular concept has been optimised to incorporate several functions in the same assembly cell. For high precision assembly of smallest and/or very delicate components under permanent vision and force control. With integration of adhesive dispenser - several different adhesives can be dispensed during the same cycle. Also integration of curing units (UV or thermal) providing the possibility to maintain the components in position during the "snap curing" phase. Feeding units for wafers, Wafflepacks and Gel-packs - which can all be used simultaneously.

 

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Come and visit Contax on stands E70 & E71