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Precision Assembly and Bonding Systems for MEMS/MOEMS from SYSMELEC

Contax Ltd - UK

SYSMELEC has developed a complete range of standard precision assembly machines (active of passive) and bonding systems for microsystems and opto-electronic components. These precision assembly machines are adaptable to specific customers needs. For this purpose a whole set of peripherals are also available to customise the standard base module to meet your needs.
The range of machines is composed of:

SMA 1000 High precision assembly machine for assembly or bonding. Vision to the top of the component. Assembly precision + / - 2 microns.

SMB 1000 High precision assembly machine for flip chip bonding. Vision to the top and the bottom of the component . Assembly precision + / - 1 micron.

SMS 1000 Submicronical assembly or alignment machine. Integration of different attachment procedures. Assembly precision + / - 0.3 microns.